摘要： 研究了高温条件下小麦旗叶光合参数的变化,结果表明,花后高温处理(超过2 h)使后期旗叶光合速率(Pn)、蒸腾速率(Tr)、气孔导度(C)和水分利用效率(WUE)等参数显著下降,胞间CO2浓度(Ci)明显增大(各参数F值均达到0.001显著水平).高温持续时间与处理后天数之间存在着极显著的互作效应,这表明高温所引起光合参数的变化随生育期的推进而呈加剧趋势.相关分析结果表明,高温胁迫下旗叶光合参数的变化与细胞膜脂过氧化代谢有密切关系,伴随着旗叶Pn,Tr,C,WUE的下降和Ci的增加,叶片膜脂过氧化产物-MDA含量显著增加,质膜相对透性明显增大;高温条件下旗叶Pn,Tr,C和WUE之间均存在极显著的正相关关系,但均与Ci呈极显著的负相关,表明高温所引起光合参数的下降主要源于非气孔因素.
关键词:
冬小麦,
高温胁迫,
光合参数,
生育后期
Abstract: Studies were carried out on changes of photosynthetic parameters in wheat flag leaf in the late stage under different high-temperature periods(HTP). The results indicated that post-anthesis high temperature stress (38℃,over 24 hours) induced significant decrease of net photosynthetic rate(Pn), transpiration rate (Tr), stomatal conductance(C), and water use efficiency (WUE) in the flag leaf, but significant increase of intercellular CO2 concentration(Ci)(all these F-values of photosynthetic parameters are significant at 0.001 level). Significant interaction effects were also found between HTP and days after treatment(DFT), which indicated that the photosynthetic parameters, such as Pn, E,C and WUE, decreased more seriously with the time going on. A close correlation existed between these photosynthetic parameters and the lipid peroxidation in plant leaf.Pn,Tr, C and WUE decreased obviously with the increase of plasm membrane permeability and the MDA content- a product of the lipid peroxidation in plant leaves. The negative correlation between Ci and Pn indicated that the decrease of Pn under high temperature stress was mainly caused by non-stomatal factors.
Key words:
Winter wheat,
High temperature stress,
Photosynthetic parameters,
Late development stage
中图分类号:
王晨阳, 朱云集, 夏国军, 王立臣, 卫丽, 时修礼. 后期高温条件下小麦旗叶光合参数的变化及其相关性分析[J]. 华北农学报, 2003, 18(3): 8-11. doi: 10.3321/j.issn:1000-7091.2003.03.003.
WANG Chen-yang, ZHU Yun-ji, XIA Guo-jun, WANG Li-chen, WEI Li, SHI Xiu-li. Changes of Photosynthetic Parameters in Wheat Flag Leaf and Their Correlation Analysis Under Post-anthesis High Temperature Conditions[J]. ACTA AGRICULTURAE BOREALI-SINICA, 2003, 18(3): 8-11. doi: 10.3321/j.issn:1000-7091.2003.03.003.