华北农学报 ›› 2008, Vol. 23 ›› Issue (6): 153-155. doi: 10.7668/hbnxb.2008.06.035

• 论文 • 上一篇    下一篇

温度和果实发育与茄子单性结实的关系研究

李冰, 潘秀清, 武彦荣, 高秀瑞   

  1. 河北省农林科学院, 经济作物研究所, 河北, 石家庄, 050051
  • 收稿日期:2008-10-15 出版日期:2008-12-28
  • 通讯作者: 潘秀清(1963-),女,河北泊头人,研究员,主要从事茄子、西瓜遗传育种工作。
  • 作者简介:李冰(1979-),女,河北石家庄人,硕士,主要从事茄子遗传育种等方面的研究。
  • 基金资助:
    河北省科技厅攻关课题(06220116D-3);石家庄市科技局科技攻关课题(07149182A)

Study on The Relationship of Temperature,Fruit Development and Parthenocarpy in Eggplant

LI Bing, PAN Xiu-qing, WU Yan-rong, GAO Xiu-rui   

  1. The Institute of Cash Crops, Hebei Academy of Agrichlture and Forestry Sciences, Shijiazhuang 050051, China
  • Received:2008-10-15 Published:2008-12-28

摘要: 以课题组选育的茄子单性结实品系D-11及非单性结实品系S8为试材,研究了温度和果实发育与茄子单性结实的关系。结果表明:最低温度是诱导茄子单性结实基因表达的主要气象因子。影响茄子单性结实基因表达的最敏感时段是开花前1 d至开花后2 d,诱导D-11品系单性结实基因表达的温度在6~15℃。单性结实品系D-11在未授粉情况下仍具有较好的结实性能,其单果重和果实纵横径均接近于授粉后生长的果实,在低温条件下的自然坐果率也明显高于对照品系S8,且比S8果实增长快、果重大。

关键词: 茄子, 单性结实, 温度, 果实发育

Abstract: The eggplant parthenocarpy line D-11 and non-parthenocarpy line S8 were studied on the relations of temperature,fruit development and parthenocarpy.The results showed that the low temperature was the mostly weather factor which induced parthenocarpic gene expression.The most sensitive stage affecting parthenocarpy was from-1 d to 2 d,and the temperature ranged from 6.3-15 ℃.The better ability of producation in the parthenocarpy line D-11 was observed without pollination.Its fruit weight,vertical and horizontal size are close to the fruit with pollination,and the fruit growth was faster than S8 line's.

Key words: Egplant, Parthenocarpy, Temperature, Fruit development

中图分类号: 

引用本文

李冰, 潘秀清, 武彦荣, 高秀瑞. 温度和果实发育与茄子单性结实的关系研究[J]. 华北农学报, 2008, 23(6): 153-155. doi: 10.7668/hbnxb.2008.06.035.

LI Bing, PAN Xiu-qing, WU Yan-rong, GAO Xiu-rui. Study on The Relationship of Temperature,Fruit Development and Parthenocarpy in Eggplant[J]. ACTA AGRICULTURAE BOREALI-SINICA, 2008, 23(6): 153-155. doi: 10.7668/hbnxb.2008.06.035.

使用本文

0
    /   /   推荐 /   导出引用

链接本文: http://www.hbnxb.net/CN/10.7668/hbnxb.2008.06.035

               http://www.hbnxb.net/CN/Y2008/V23/I6/153