华北农学报 ›› 2008, Vol. 23 ›› Issue (6): 1-5. doi: 10.7668/hbnxb.2008.06.001

所属专题: 小麦 生物技术

• 论文 •    下一篇

小麦热胁迫相关蛋白Hsa32基因的克隆

李国良, 张红梅, 周人纲   

  1. 河北省农林科学院, 遗传生理研究所, 河北省植物转基因中心, 河北, 石家庄, 050051
  • 收稿日期:2008-10-28 出版日期:2008-12-28
  • 作者简介:李国良(1979-),男,河北丰润人,助理研究员,主要从事植物抗逆生理研究。
  • 基金资助:
    河北省自然科学基金(C2004000726);河北省农林科学院青年基金(A06060102)

Cloning of a Heat-stress-associated Protein Hsa32 Gene from Wheat

LI Guo-liang, ZHANG Hong-mei, ZHOU Ren-gang   

  1. Institute of Genetics and Physiology, Hebei Academy of Agriculture and Forestry Sciences, Shijiazhuang 050051, China
  • Received:2008-10-28 Published:2008-12-28

摘要: 热胁迫相关蛋白Hsa32主要存在于陆生植物中,Hsa32参与植物获得性耐热性的维持。本研究以37℃热胁迫1 h的小麦幼苗叶子为材料,提取总RNA,结合RT-PCR和RACE的方法克隆获得小麦Hsa32基因,该基因完整的开放阅读框全长88 bp,编码294个氨基酸。编码的氨基酸与水稻中Hsa32(OsHsa32)同一性最高,达83%,与拟南芥中Hsa32(AtHsa32)有66%的同一性,与番茄中Hsa32(LeHsa32)有63%的同一性,由此将其命名为TaHsa32。Northern杂交结果表明,TaHsa32是一个诱导型热激蛋白。

关键词: 小麦, 热激蛋白, Hsa32, 克隆

Abstract: Hsa32 (heat-stress-associated 322kDa protein) is mainly found in land plants and takes part in acquired thermotolerance in plants. A novel Hsa32 protein gene was cloned from wheat (Triticum aestivum L.) after heat stress 1 h at 37℃using RT-PCR and RACE(rapid amplification of cDNA ends) technology,and named as TaHsa32. The complete open reading frame (ORF)of the TaHsa32cDNA was 885 bp and encoding a protein of 294 amino acid residues. The comparison of the deduced amino acid sequences of the TaHsa32 with OsHsa32 (from rice),AtHsa32 (from Arabidopsis) and LeHsa32 (from tomato) showed that this was a highly conserved protein and the identity was 83 %,66%,63%,respectively. Using Northern blot analysis it was found that the expression of TaHsa32 gene was a induced by heat stress.

Key words: Wheat, Heat shock protein, Hsa32, Cloning

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引用本文

李国良, 张红梅, 周人纲. 小麦热胁迫相关蛋白Hsa32基因的克隆[J]. 华北农学报, 2008, 23(6): 1-5. doi: 10.7668/hbnxb.2008.06.001.

LI Guo-liang, ZHANG Hong-mei, ZHOU Ren-gang. Cloning of a Heat-stress-associated Protein Hsa32 Gene from Wheat[J]. ACTA AGRICULTURAE BOREALI-SINICA, 2008, 23(6): 1-5. doi: 10.7668/hbnxb.2008.06.001.

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