华北农学报 ›› 1991, Vol. 6 ›› Issue (1): 68-73. doi: 10.7668/hbnxb.1991.01.012

所属专题: 抗旱节水

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水分胁迫条件下高粱叶片的渗透调节及其对气孔导度和蒸腾速率的影响

王玉国, 荆家海, 王韶唐   

  1. 1. 山西农业大学, 太谷 03080;
    2. 西北农业大学, 杨陵 712100
  • 收稿日期:1989-07-21 出版日期:1991-03-28
  • 基金资助:
    国家自然科学基金

The Effects of Osmotic Adjustment in Sorghum Leaves on Stomatal Conductance and Transpiration Rate under Water Stress

WangYuguo, JingJiahai, WangShaotang   

  1. Shanxi Agricultural University, Taigu 030801)Jing Jiahai Wang Shaotang(Northwestern Agricultural University, Yangling 712100
  • Received:1989-07-21 Published:1991-03-28

摘要: 两个抗旱性不同的高粱品种“3197B”和“三尺三”,在水分胁迫条件下,抗旱品种3197B渗透势降低,渗透调节能力较强.正常灌水时,两品种的气孔导度和蒸腾速率均随光照增强而增加,品种间差异不大;水分胁迫条件下,上午3197B气孔导度和蒸腾速率高于三尺三,午后水分胁迫严重时又低于三尺三,但其叶水势和膨压比三尺三高.

关键词: 高粱, 水分胁迫, 渗透势, 渗透调节, 气孔导度, 蒸腾速率

Abstract: Osmotic adjustment capacity and its effect on stomatal conductance and transpiration rate were studied using seedling of two sorghum cultivars different in drought resistance (CV. 3197B, drought-resistance and San Chi San, drought susceptible) under water stress. The results showed that 3197B had a more negative osmotic potential and a higher osmotic adjustment. At normal moisture scheme, stomatal conductance and transpiration rate of both cultivars increased with the increase of solor radiation, and San Chi San exhibited a slightly higher conductance. Under water stress, the stomatal conductance and transpiration rate of 3197B were higher in the morning and lower in the afternoon than those of San Chi San, but water potential and turgor potential of the former were higher than the latter.

Key words: Sorghum, Water stress, Osmotic potential, Osmotic Adjustment, Stomatal conductance, Transpiration rate

引用本文

王玉国, 荆家海, 王韶唐. 水分胁迫条件下高粱叶片的渗透调节及其对气孔导度和蒸腾速率的影响[J]. 华北农学报, 1991, 6(1): 68-73. doi: 10.7668/hbnxb.1991.01.012.

WangYuguo, JingJiahai, WangShaotang. The Effects of Osmotic Adjustment in Sorghum Leaves on Stomatal Conductance and Transpiration Rate under Water Stress[J]. ACTA AGRICULTURAE BOREALI-SINICA, 1991, 6(1): 68-73. doi: 10.7668/hbnxb.1991.01.012.

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