华北农学报 ›› 2001, Vol. 16 ›› Issue (2): 99-103. doi: 10.3321/j.issn:1000-7091.2001.02.019

所属专题: 小麦

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灌浆期高温胁迫对冬小麦叶源、库器官生理活性的影响及调控

郑飞1, 臧秀旺1, 黄保荣1, 何钟佩2   

  1. 1. 河南省农业科学院小麦研究所, 河南郑州 450002;
    2. 中国农业大学作物化控研究中心, 北京 100094
  • 收稿日期:2000-12-13 出版日期:2001-06-28
  • 作者简介:郑飞(1971- ),男,农学博士,主要从事小麦栽培生理及化学调控研究工作。

Effects of High Temperature Stress on the Source and Sink Organ of Winter Wheat During Filling Stage and Its Regulation

ZHENG Fei1, ZANG Xiuwang1, HUANG Baorong1, HE Zhongpei2   

  1. 1. Crop Chemical Co ntrol Lab of WHIAAS, Zhengzhou 450002, China;
    2. Crop Chemical Control Center, China Agricultural University , Beijing 100094, China
  • Received:2000-12-13 Published:2001-06-28

摘要: 研究了灌浆期高温胁迫条件对冬小麦叶源、库器官某些生理指标的影响。结果表明,高温胁迫导致冬小麦叶源、库活性显著降低。高温胁迫能显著降低冬小麦子粒蔗糖酶的活性,降低子粒可溶性糖含量,胁迫发生初期子粒ATP酶的活性迅速降低;高温胁迫导致冬小麦的旗叶MDA含量、脯氨酸含量上升。适当的调节剂处理能显著改变高温胁迫条件下上述生理指标的变化动态,显著抑制高温胁迫条件下冬小麦旗叶光合性能的下降,延缓叶片衰老的进程,对保持叶源、库器官的生理活性有显著的作用,协调源库关系,降低高温胁迫对植株的伤害程度。

关键词: 高温胁迫, 叶源器官, 库器官, 调节剂

Abstract: The study focused on the physiolog ical damages of the high temperature stress on the winter wheat in the filling stage. The follow ing aspects were researched in this experiment,the result indicated that the high temperature stress can decrease the activity of ATPase, decrease the content of solubility sugar on the grain. The stress can improve the MDA and Pro content in the flag leaf and the 2nd leaf from top.Huakong Ⅱ(Ⅱ) can restrain the decrease of ATPase act ivity of the g rain and the MDA and Pro content in the function leaves, in this way, it keep the higher activity of source and sink organ of winter wheat under the stress condition.

Key words: Winter wheat, High temperature stress, Leaf activity

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引用本文

郑飞, 臧秀旺, 黄保荣, 何钟佩. 灌浆期高温胁迫对冬小麦叶源、库器官生理活性的影响及调控[J]. 华北农学报, 2001, 16(2): 99-103. doi: 10.3321/j.issn:1000-7091.2001.02.019.

ZHENG Fei, ZANG Xiuwang, HUANG Baorong, HE Zhongpei. Effects of High Temperature Stress on the Source and Sink Organ of Winter Wheat During Filling Stage and Its Regulation[J]. ACTA AGRICULTURAE BOREALI-SINICA, 2001, 16(2): 99-103. doi: 10.3321/j.issn:1000-7091.2001.02.019.

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