华北农学报 ›› 2008, Vol. 23 ›› Issue (2): 214-216. doi: 10.7668/hbnxb.2008.02.047

所属专题: 黄瓜

• 论文 • 上一篇    下一篇

不同黄瓜材料对枯萎病的抗性评价

毛爱军, 张峰, 张丽蓉, 王永健   

  1. 北京市农林科学院, 蔬菜研究中心, 北京, 100097
  • 收稿日期:2006-08-23 出版日期:2008-04-28
  • 作者简介:毛爱军(1969-),女,北京人,副研究员,硕士,主要从事黄瓜抗病育种研究.
  • 基金资助:
    北京市自然科学基金项目(5062009);国家“863”计划(2002AA244021);国家自然科学基金项目(30471186)

Identification of Resistance to Fusarium oxysporum f.sp.cucumerinum on Cucumber

MAO Ai-jun, ZHANG Feng, ZHANG Li-rong, WANG Yong-jian   

  1. Beijing Vegetable Research Center, Beijing Academy of Agriculture and Forestry Science, Beijing 100097, China
  • Received:2006-08-23 Published:2008-04-28

摘要: 以危害我国黄瓜的优势枯萎病生理小种4为供试菌源,运用室内苗期人工接种和田间成株期病圃检测2种方法对43份黄瓜材料进行了枯萎病的抗性评价,苗期接种筛选出抗病材料7份,中抗材料16份,感病和高感材料20份。其中抗(含中抗)材料占53.5%,感病材料占46.5%。欧洲血缘的抗病(中抗以上)材料占39.5%;华北和日本血缘的抗和中抗材料占13.9%。成株期田间病圃的鉴定结果与苗期接种基本一致,符合率达86.7%。说明苗期接种结果准确,接种方法可靠。同时还表明了黄瓜种质资源中蕴藏着对改良枯萎病抗性有利用价值的基因资源,其中欧洲黄瓜抗源较丰富,华北和日本类型的黄瓜枯萎病抗源相对匮乏。

关键词: 黄瓜, 枯萎病, 抗性, 评价

Abstract: Forty-three cucumber materials were evaluated for resistance to Fusarium wilt race 4 by seedling stage inoculation in lab and adult plant evaluation in the infested field,respectively.The result showed that using seedling inoculation method,23 materials obtained from 43 materials were resistant(or tolerant) to Fusarium wilt race 4,20 materials were susceptible.The evaluation results in infested field were corresponding with that at seedling stage.And European cucumber materials expressed higher resistance than Japanese and Chinese materials to Fusarium wilt race 4.These resistance resources could be used in cucumber Fusarium wilt resistance breeding.

Key words: Cucumber(Cucumis satavus L.), Fusurium oxysporum f. sp.cucuumvranum Owen, Resistance, Identfi-cation

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引用本文

毛爱军, 张峰, 张丽蓉, 王永健. 不同黄瓜材料对枯萎病的抗性评价[J]. 华北农学报, 2008, 23(2): 214-216. doi: 10.7668/hbnxb.2008.02.047.

MAO Ai-jun, ZHANG Feng, ZHANG Li-rong, WANG Yong-jian. Identification of Resistance to Fusarium oxysporum f.sp.cucumerinum on Cucumber[J]. ACTA AGRICULTURAE BOREALI-SINICA, 2008, 23(2): 214-216. doi: 10.7668/hbnxb.2008.02.047.

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